06
Dec
Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Adhesive
Underfill epoxy is a substance that fills in the gaps between the boards. It is applied to the surface of the board and then brushed over to fill in any gaps. There are two types of underfill epoxy: liquid and solid. Liquid underfill epoxy is applied with a brush or roller, which is then allowed … Read more